AD8342ACPZ-R2 datasheet(5/25 Pages) AD

5 / 25 page

Data Sheet

AD8342

Rev. C | Page 5 of 25

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage, VS

5.5 V

RF Input Level

12 dBm

LO Input Level

12 dBm

PWDN Pin

VS + 0.5 V

IFOP, IFOM Bias Voltage

5.5 V

Minimum Resistor from EXRB to COMM

1.8 kΩ

Internal Power Dissipation

650 mW

θJA1

77°C/W

θJB1

37.4°C/W

Maximum Junction Temperature

135°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Measured using a JESD51-7 printed circuit board (PCB).

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

JUNCTION TO BOARD THERMAL IMPEDANCE

The junction to board thermal impedance (θJB) is the thermal

impedance from the die to the leads of the AD8342. The value

given in Table 3 is based on the standard PCB described in

JESD51-7 for the thermal testing of a surface-mount component.

Board size and complexity (number of layers) affect θJB; more

layers tend to reduce thermal impedance slightly.

If the board temperature is known, use the junction to board

thermal impedance to calculate the die temperature (also

known as the junction temperature) to ensure that it does not

exceed the specified limit of 135°C. For example, if the board

temperature is 85°C, the die temperature is given by the

equation,

(

)

DISS

The worst case power dissipation for the AD8342 is 593 mW

(5.25 V × 113 mA, see Table 1). Therefore, TJ is

(

)

107

C/W

593

ESD CAUTION

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