LQFP64 datasheet(67/116 Pages) STMICROELECTRONICS

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SPC560B40x/50x, SPC560C40x/50x

Package pinouts and signal descriptions

115

IDDSTOP

STOP mode current(7)

Slow internal RC oscillator

(128 kHz) running

TA = 25 °C

—

180

700(8)

µA

DTA = 55 °C

—

500

—

DTA = 85 °C

—

6(8)

DTA = 105 °C

—

9(8)

PTA = 125 °C

—

4.5

12(8)

IDDSTDBY2 CC

STANDBY2 mode

current(9)

Slow internal RC oscillator

(128 kHz) running

TA = 25 °C

—

100

µA

DTA = 55 °C

—

DTA = 85 °C

—

180

700

DTA = 105 °C

—

315

1000

PTA = 125 °C

—

560

1700

IDDSTDBY1 CC

STANDBY1 mode

current(10)

Slow internal RC oscillator

(128 kHz) running

TA = 25 °C

—

µA

DTA = 55 °C

—

DTA = 85 °C

—

100

350

DTA = 105 °C

—

165

500

DTA = 125 °C

—

280

900

VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified

IDDMAX is drawn only from the VDD_BV pin. Running consumption does not include I/Os toggling which is highly dependent

on the application. The given value is thought to be a worst case value with all peripherals running, and code fetched from

code flash while modify operation ongoing on data flash. Notice that this value can be significantly reduced by application:

switch off not used peripherals (default), reduce peripheral frequency through internal prescaler, fetch from RAM most used

functions, use low power mode when possible.

Higher current may be sinked by device during power-up and standby exit. Please refer to in rush current on Table 26.

IDDRUN is drawn only from the VDD_BV pin. RUN current measured with typical application with accesses on both flash and

RAM.

Only for the “P” classification: Data and Code Flash in Normal Power. Code fetched from RAM: Serial IPs CAN and LIN in

loop back mode, DSPI as Master, PLL as system Clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and running at

max frequency, periodic SW/WDG timer reset enabled.

Data Flash Power Down. Code Flash in Low Power. SIRC (128 kHz) and FIRC (16 MHz) on. 10 MHz XTAL clock.

FlexCAN: instances: 0, 1, 2 ON (clocked but not reception or transmission), instances: 4, 5, 6 clock gated. LINFlex:

instances: 0, 1, 2 ON (clocked but not reception or transmission), instance: 3 clock gated. eMIOS: instance: 0 ON (16

channels on PA[0]–PA[11] and PC[12]–PC[15]) with PWM 20 kHz, instance: 1 clock gated. DSPI: instance: 0 (clocked but

no communication). RTC/API ON. PIT ON. STM ON. ADC ON but not conversion except 2 analog watchdog.

Only for the “P” classification: No clock, FIRC (16 MHz) off, SIRC (128 kHz) on, PLL off, HPvreg off, ULPVreg/LPVreg on.

All possible peripherals off and clock gated. Flash in power down mode.

When going from RUN to STOP mode and the core consumption is > 6 mA, it is normal operation for the main regulator

module to be kept on by the on-chip current monitoring circuit. This is most likely to occur with junction temperatures

exceeding 125 °C and under these circumstances, it is possible for the current to initially exceed the maximum STOP

specification by up to 2 mA. After entering stop, the application junction temperature will reduce to the ambient level and

the main regulator will be automatically switched off when the load current is below 6 mA.

Only for the “P” classification: ULPreg on, HP/LPVreg off, 32 KB RAM on, device configured for minimum consumption, all

possible modules switched off.

10. ULPreg on, HP/LPVreg off, 8 KB RAM on, device configured for minimum consumption, all possible modules switched off.

Table 28. Power consumption on VDD_BV and VDD_HV (continued)

Symbol

Parameter

Conditions(1)

Value

Unit

Min

Typ

Max

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