LQFP64 datasheet(44/116 Pages) STMICROELECTRONICS

44 / 116 page

Package pinouts and signal descriptions

SPC560B40x/50x, SPC560C40x/50x

44/116

DocID14619 Rev 13

Note:

RAM data retention is guaranteed with VDD_LV not below 1.08 V.

3.14

Thermal characteristics

3.14.1

Package thermal characteristics

IINJPAD

Injected input current on any pin during

overload condition

—

55

IINJSUM

Absolute sum of all injected input currents

during overload condition

—

50

TVDD

SR VDD slope to ensure correct power up

(6)

—3.0(7)

250 x 103

(0.25

[V/µs])

V/s

100 nF capacitance needs to be provided between each VDD/VSS pair.

Full device operation is guaranteed by design when the voltage drops below 4.5 V down to 3.0 V. However, certain analog

electrical characteristics will not be guaranteed to stay within the stated limits.

330 nF capacitance needs to be provided between each VDD_LV/VSS_LV supply pair.

100 nF capacitance needs to be provided between VDD_BV and the nearest VSS_LV (higher value may be needed

depending on external regulator characteristics).

1 µF (electrolithic/tantalum) + 47 nF (ceramic) capacitance needs to be provided between VDD_ADC/VSS_ADC pair. Another

ceramic cap of 10 nF with low inductance package can be added.

Guaranteed by device validation.

Minimum value of TVDD must be guaranteed until VDD reaches 2.6 V (maximum value of VPORH).

Table 14. Recommended operating conditions (5.0 V) (continued)

Symbol

Parameter

Conditions

Value

Unit

Min

Max

Table 15. LQFP thermal characteristics(1)

Symbol

Parameter

Conditions(2)

Pin count

Value

Unit

RJA

Thermal resistance, junction-to-

ambient natural convection(3)

Single-layer board - 1s

°C/W

100

144

Four-layer board - 2s2p

100

144

RJB

Thermal resistance, junction-to-

board(4)

Single-layer board - 1s

°C/W

100

144

Four-layer board - 2s2p

100

144

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