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LQFP64 Datasheet(PDF) 108 Page - STMicroelectronics |
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LQFP64 Datasheet(HTML) 108 Page - STMicroelectronics |
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108 / 116 page  Revision history SPC560B40x/50x, SPC560C40x/50x 108/116 DocID14619 Rev 13 Revision history Table 55. Document revision history Date Revision Changes 04-Apr-2008 1 Initial release. 06-Mar-2009 2 Made minor editing and formatting changes to improve readability Harmonized oscillator naming throughout document Modified document title Updated “Feature” on cover page Replaced LFBGA208 with LBGA208 Updated “Description” Section Updated “SPC560B40x/50x and SPC560C40x/50x device comparison” table Added “Block diagram” section Section 3 “Package pinouts and signal descriptions”: – Removed signal descriptions (these are found in the device reference manual) Updated “LQFP 144-pin configuration (top view)” figure: – Replaced VPP with VSS_HV on pin 18 – Added MA[1] as AF3 for PC[10] (pin 28) – Added MA[0] as AF2 for PC[3] (pin 116) – Changed description for pin 120 to PH[10] / GPIO[122] / TMS – Changed description for pin 127 to PH[9] / GPIO[121] / TCK – Replaced NMI[0] with NMI on pin 11 Updated “LQFP 100-pin configuration (top view)” figure: – Replaced VPP with VSS_HV on pin 14 – Added MA[1] as AF3 for PC[10] (pin 22) – Added MA[0] as AF2 for PC[3] (pin 77) – Changed description for pin 81 to PH[10] / GPIO[122] / TMS – Changed description for pin 88 to PH[9] / GPIO[121] / TCK – Removed E1UC[19] from pin 76 – Replaced [11] with WKUP[11] for PB[3] (pin 1) – Replaced NMI[0] with NMI on pin 7 Updated “LBGA208 configuration” figure: – Changed description for ball B8 from TCK to PH[9] – Changed description for ball B9 from TMS to PH[10] – Updated descriptions for balls R9 and T9 Added “Parameter classification” section and tagged parameters in tables where appropriate Added “NVUSRO register” section Updated “Absolute maximum ratings” table “Recommended operating conditions” section : – Added note on RAM data retention to end of section Updated “Recommended operating conditions (3.3 V)” and “Recommended operating conditions (5.0 V)” Added “Package thermal characteristics” section Updated “Power considerations” section Updated I/O input DC electrical characteristics definition” figure |
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