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L99VR02J Datasheet(PDF) 28 Page - STMicroelectronics |
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L99VR02J Datasheet(HTML) 28 Page - STMicroelectronics |
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28 / 38 page ![]() 6 Package and PCB thermal data 6.1 PowerSSO-12 thermal data Figure 44. PowerSSO-12 PC board Note: The values quoted are for PCB 77 mm x 86 mm x 1.6 mm, FR4, two and four layers; Cu thickness 0.070 mm (outer layers). Cu thickness 0.035 mm (inner layers), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, footprint dimension 2.2 mm x 2.9 mm. L99VR02J Package and PCB thermal data DS14076 - Rev 1 page 28/38 |
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