MB91F528 datasheet(238/241 Pages) SPANSION

238 / 241 page

D at aS h ee t

208-pin plastic TEQFP

Lead pitch

0.50 mm

Package width ×

package length

28.00 mm × 28.00 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm Max.

Weight

2.55 g

Code

(Reference)

P-TEQFP208-28×28-0.50

208-pin plastic TEQFP

(FPT-208P-M36)

0.22±0.05

(.009±.002)

*28.00±0.10(1.142±.004) SQ

30.00±0.20(1.181±.008) SQ

0.145±0.055

1.50

(.059

)

˚~8˚

0.25(.010)

0.10±0.10

(.004±.004)

INDEX

Details of "A" part

(.020)

0.60±0.15

(.024±.006)

"A"

0.50

104

156

105

208

157

(.006±.002)

0.08(.003)

(9.26(.365) SQ)

2013 FUJITSU SEMICONDUCTOR LIMITED HMbF208-36Sc-1-1

(8.06(.317) SQ)

(Mounting height)

(STAND OFF)

+0.20

-0.10

+.008

-.004

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

Please confirm the latest Package dimension by following URL.

http://edevice.fujitsu.com/package/en-search/

March 28, 2014, MB91F528_DS705-00016-1v0-E

235

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