MB91F528 datasheet(239/241 Pages) SPANSION

Part #	MB91F528

Description	This document states the current technical specifications regarding

PDF	241 Pages

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D at aS h ee t

416-pin plastic PBGA

Lead pitch

1.00 mm

Package width ×

package length

27.00 mm × 27.00 mm

Lead shape

Ball

Sealing method

Plastic mold

Mounting height

2.37 mm MAX

416-pin plastic PBGA

(BGA-416P-M05)

2006-2010 FUJITSU SEMICONDUCTOR LIMITED BGA416005Sc-2-4

24.00±0.10(.945±.004)

27.00(1.063)

27.00

24.00±0.10

(1.063)

(.945±.004)

0.20(.008) (4X)

25.00(.984)

1.00(.039)

REF

1.00(.039)

REF

25.00

(.984)

ø0.60±0.10(.024±.004)

0.10(.004)

0.25(.010) M

0.50±0.10

(.020±.004)

2.37(.093)

Max.

0.15(.006)

INDEX

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Please confirm the latest Package dimension by following URL.

http://edevice.fujitsu.com/package/en-search/

236

MB91F528_DS705-00016-1v0-E, March 28, 2014

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