MB91F528 datasheet(233/241 Pages) SPANSION

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D at aS h ee t

 PACKAGE DIMENSIONS

144-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

20.0 × 20.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

1.20 g

Code

(Reference)

P-LFQFP144-20×20-0.50

144-pin plastic LQFP

(FPT-144P-M08)

Details of "A" part

0.25(.010)

(Stand off)

(.004±.004)

0.10±0.10

(.024±.006)

0.60±0.15

(.020±.008)

0.50±0.20

1.50

+0.20

–0.10

+.008

–.004

.059

0°~8°

0.50(.020)

"A"

0.08(.003)

0.145±0.055

(.006±.002)

LEAD No. 1

INDEX

108

109

144

0.22±0.05

(.009±.002)

0.08(.003)

22.00±0.20(.866±.008)SQ

(Mounting height)

* 20.00±0.10(.787±.004)SQ

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) *:Values do not include resin protrusion.

Resin protrusion is +0.25(.010)Max(each side).

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

2003-2010 FUJITSU SEMICONDUCTOR LIMITED F144019S-c-4-8

Please confirm the latest Package dimension by following URL.

http://edevice.fujitsu.com/package/en-search/

230

MB91F528_DS705-00016-1v0-E, March 28, 2014

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