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SPC560B50x Datasheet(PDF) 45 Page - STMicroelectronics |
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SPC560B50x Datasheet(HTML) 45 Page - STMicroelectronics |
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45 / 116 page ![]() DocID14619 Rev 13 45/116 SPC560B40x/50x, SPC560C40x/50x Package pinouts and signal descriptions 115 3.14.2 Power considerations The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1: Equation 1TJ = TA + (PD x RJA) Where: TA is the ambient temperature in °C. RJA is the package junction-to-ambient thermal resistance, in °C/W. PD is the sum of PINT and PI/O (PD = PINT + PI/O). PINT is the product of IDD and VDD, expressed in watts. This is the chip internal power. PI/O represents the power dissipation on input and output pins; user determined. RJC CC D Thermal resistance, junction-to- case(5) Single-layer board - 1s 64 11 °C/W 100 22 144 22 Four-layer board - 2s2p 64 11 100 22 144 22 JB CC D Junction-to-board thermal characterization parameter, natural convection Single-layer board - 1s 64 TBD °C/W 100 33 144 34 Four-layer board - 2s2p 64 TBD 100 34 144 35 JC CC D Junction-to-case thermal characterization parameter, natural convection Single-layer board - 1s 64 TBD °C/W 100 9 144 10 Four-layer board - 2s2p 64 TBD 100 9 144 10 1. Thermal characteristics are based on simulation. 2. VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C 3. Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC specification for this package. 4. Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for the specified package. 5. Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer. Table 15. LQFP thermal characteristics(1) (continued) Symbol C Parameter Conditions(2) Pin count Value Unit |
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