ADF4252BCPZ-R7 datasheet(30/30 Pages) AD

30 / 30 page

ADF4252

Data Sheet

Rev. E | Page 30 of 30

OUTLINE DIMENSIONS

0.30

0.25

0.20

0.80

0.75

0.70

0.20 MIN

2.20

2.10 SQ

2.00

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8

BOTTOM VIEW

TOP VIEW

SIDE VIEW

4.10

4.00 SQ

3.90

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

EXPOSED

PAD

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

PIN 1

INDICATOR

AREA

SEATING

PLANE

Figure 45. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADF4252BCPZ

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-10

ADF4252BCPZ-RL

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-10

ADF4252BCPZ-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-10

EVAL-ADF4252EBZ2

Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D02946-0-8/19(E)

ADF4252BCPZ-R7 Datasheet(PDF) 30 Page - Analog Devices

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