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LQFP64 Datasheet(PDF) 52 Page - STMicroelectronics

Part # LQFP64
Description  Non-maskable interrupt
PDF  90 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

LQFP64 Datasheet(HTML) 52 Page - STMicroelectronics

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Electrical characteristics
SPC560D30x, SPC56040Dx
52/90
Doc ID 16315 Rev 7
4.12
Electromagnetic compatibility (EMC) characteristics
Susceptibility tests are performed on a sample basis during product characterization.
4.12.1
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user apply EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of
runaway conditions such as:
Corrupted program counter
Unexpected reset
Critical data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program
counter corruption) can be reproduced by manually forcing a low state on the reset pin
or the oscillator pins for 1 second.
To complete these trials, ESD stress can be applied directly on the device. When
unexpected behavior is detected, the software can be hardened to prevent
unrecoverable errors occurring (see the application note Software Techniques For
Improving Microcontroller EMC Performance (AN1015)).
4.12.2
Electromagnetic interference (EMI)
The product is monitored in terms of emission based on a typical application. This emission
test conforms to the IEC 61967-1 standard, which specifies the general conditions for EMI
measurements.
tFLALPEXIT
C
C
T
Delay for flash module to exit low-power
mode(2)
Code flash
0.5
µs
tFLAPDEXIT
C
C
T
Delay for flash module to exit power-down
mode
Code flash
30
µs
Data flash
30(3)
µs
tFLALPENTRY
C
C
T
Delay for flash module to enter low-power
mode
Code flash
0.5
µs
tFLAPDENTRY
C
C
T
Delay for flash module to enter power-
down mode
Code flash
1.5
µs
Data flash
4(3)
µs
1.
VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified
2.
Data flash does not support low-power mode
3.
If code flash is already switched-on.
Table 32.
Start-up time/Switch-off time (continued)
Symbol
C
Parameter
Conditions(1)
Value
Unit
Min
Typ
Max



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