LQFP64 datasheet(34/90 Pages) STMICROELECTRONICS

34 / 90 page

Electrical characteristics

SPC560D30x, SPC56040Dx

34/90

Doc ID 16315 Rev 7

Equation 1 TJ = TA + (PD x RJA)

Where:

TA is the ambient temperature in °C.

RJA is the package junction-to-ambient thermal resistance, in °C/W.

PD is the sum of PINT and PI/O (PD = PINT + PI/O).

PINT is the product of IDD and VDD, expressed in watts. This is the chip internal

power.

PI/O represents the power dissipation on input and output pins; user determined.

Most of the time for the applications, PI/O< PINT and may be neglected. On the other hand,

PI/O may be significant, if the device is configured to continuously drive external modules

and/or memories.

An approximate relationship between PD and TJ (if PI/O is neglected) is given by:

Equation 2 PD = K / (TJ + 273 °C)

Therefore, solving equations 1 and 2:

Equation 3 K = PD x (TA + 273 °C) + RJA x PD

Where:

K is a constant for the particular part, which may be determined from Equation 3

by measuring PD (at equilibrium) for a known TA. Using this value of K, the values

of PD and TJ may be obtained by solving equations 1 and 2 iteratively for any value

of TA.

4.7

I/O pad electrical characteristics

4.7.1

I/O pad types

The device provides four main I/O pad types depending on the associated alternate

functions:

●

Slow pads—These pads are the most common pads, providing a good compromise

between transition time and low electromagnetic emission.

●

Medium pads—These pads provide transition fast enough for the serial communication

channels with controlled current to reduce electromagnetic emission.

●

Input only pads—These pads are associated to ADC channels (ADC_P[X]) providing

low input leakage.

Medium pads can use slow configuration to reduce electromagnetic emission except for

PC[1], that is medium only, at the cost of reducing AC performance.

4.7.2

I/O input DC characteristics

Table 15 provides input DC electrical characteristics as described in Figure 4.

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