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10HSI-S008-R0-C Datasheet(PDF) 23 Page - Hirose Electric |
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10HSI-S008-R0-C Datasheet(HTML) 23 Page - Hirose Electric |
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23 / 71 page  Signal Integrity Report – IT3 (32mm) Page 23 Figure 35 Power Sum of FEXT for pair 4 of via+connector+via transition with routing on layer 16 for 50% pin density configuration Figure 36 ICR profile of FEXT for pair 4 of via+connector+via transition with routing on layer 16 for 50% pin density configuration 3.1.4 W-element Model (PCB trace) The signal traces in the PCB follow the cross section in Figure 37 for 100 Ohms differential impedance. The corresponding W-element model and differential S parameters are shown in Figure 38 and Figure 39. The RL comparisons with the IEEE 802.3ap spec for the full channel model with the connector, vias and PCB traces of 76.2mm + 76.2mm (3” + 3”) and 152.4mm + 152.4mm (6” + 6”) are shown in Figure 40 and Figure 41. |
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