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SPC572L64F2 Datasheet(PDF) 34 Page - STMicroelectronics |
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SPC572L64F2 Datasheet(HTML) 34 Page - STMicroelectronics |
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34 / 112 page ![]() Electrical characteristics SPC572Lx 34/112 DocID027866 Rev 5 In order to ensure device reliability, the average current of the I/O on a single segment should remain below the IAVGSEG maximum value. In order to ensure device functionality, the sum of the dynamic and static currents of the I/O on a single segment should remain below the IDYNSEG maximum value. Pad mapping on each segment can be optimized using the pad usage information provided in the I/O Signal Description table. The sum of all pad usage ratios within a segment should remain below 100%. Note: In order to maintain the required input thresholds for the SENT interface, the sum of all I/O pad output percent IR drop as defined in the I/O Signal Description table, must be below 50 %. See the I/O Signal Description attachment. Note: The SPC572Lx I/O Signal Description and Input Multiplexing Tables are contained in a Microsoft Excel® workbook file attached to this document. Locate the paperclip symbol on the left side of the PDF window, and click it. Double-click on the Excel file to open it and select the I/O Signal Description Table tab. Table 18. I/O consumption(1) Symbol C Parameter Conditions Value Unit Min Typ Max IRMS_SEG SR D Sum of all the DC I/O current within a supply segment VDD = 5.0 V ± 10% — — 80 mA VDD = 3.3 V ± 10% — — 80 IRMS_W CC D RMS I/O current for WEAK configuration CL = 25 pF, 2 MHz VDD = 5.0 V ± 10% —— 1.1 mA CL = 50 pF, 1 MHz VDD = 5.0 V ± 10% —— 1.1 CL = 25 pF, 2 MHz VDD = 3.3 V ± 10% —— 0.6 CL = 50 pF, 1 MHz VDD = 3.3 V ± 10% —— 0.6 IRMS_M CC D RMS I/O current for MEDIUM configuration CL = 25 pF, 12 MHz VDD = 5.0 V ± 10% —— 4.7 mA CL = 50 pF, 6 MHz VDD = 5.0 V ± 10% —— 4.8 CL = 25 pF, 12 MHz VDD = 3.3 V ± 10% —— 2.6 CL = 50 pF, 6 MHz VDD = 3.3 V ± 10% —— 2.7 |
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