LP8501 datasheet(6/51 Pages) TI1

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LP8501

SNVS548D – SEPTEMBER 2008 – REVISED AUGUST 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

VDD

−0.3V to +6.0V

Voltage on D1 to D9, C1

−, C1+, C2−, C2+,

−0.3V to + 6.0V

VOUT

Voltage on Logic Pins (Input or Output Pins)

−0.3V to VDD +0.3V

with 6.0V max

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJ-MAX)

125°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature (Soldering)

See(5)

ESD Rating

Human Body Model: D1 to D9

4 kV(6)

Human Body Model: All Other Pins

2.5 kV(6)

Machine Model: All Pins

250V(7)

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C (typ.).

(5)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN1112 : DSBGA Wafer Level

Chip Scale Package.

(6)

Human Body Model, applicable standard JESD22-A114C

(7)

Machine Model, applicable standard JESD22-A115-A

OPERATING RATINGS

(1) (2)

VDD Input Voltage Range

2.7V to 5.5V

Voltage on Logic Pins (Input or Output Pins)

0 to VDD

Recommended Charge Pump Load Current

0 mA to 100 mA

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

THERMAL PROPERTIES

Junction-to-Ambient Thermal Resistance (

θJA)

(1),

Thermal Package

87°C/W

YFQ0025 Package(2)

(1)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C (typ.).

(2)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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