Electronic Components Datasheet Search
  Indian  ▼
ALLDATASHEET.IN

X  

ADP5056ACCZ-R7 Datasheet(PDF) 7 Page - Analog Devices

Part # ADP5056ACCZ-R7
Description  Triple Buck Regulator Integrated Power Solution
PDF  31 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADP5056ACCZ-R7 Datasheet(HTML) 7 Page - Analog Devices

Back Button ADP5056ACCZ-R7 Datasheet HTML 3Page - Analog Devices ADP5056ACCZ-R7 Datasheet HTML 4Page - Analog Devices ADP5056ACCZ-R7 Datasheet HTML 5Page - Analog Devices ADP5056ACCZ-R7 Datasheet HTML 6Page - Analog Devices ADP5056ACCZ-R7 Datasheet HTML 7Page - Analog Devices ADP5056ACCZ-R7 Datasheet HTML 8Page - Analog Devices ADP5056ACCZ-R7 Datasheet HTML 9Page - Analog Devices ADP5056ACCZ-R7 Datasheet HTML 10Page - Analog Devices ADP5056ACCZ-R7 Datasheet HTML 11Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 7 / 31 page
background image
Data Sheet
ADP5056
Rev. 0 | Page 7 of 31
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VBIAS to GND
−0.3 V to +21 V
PVINx to PGND
−0.3 V to +21 V
SWx to PGND
−0.3 V to +21 V
RAMPx to GND
−0.3 V to +21 V
PGND to GND
−0.3 V to +0.3 V
BST1 to SW1
−0.3 V to +6.5 V
BST2 to SW2
−0.3 V to +6.5 V
BST3 to SW3
−0.3 V to +6.5 V
CFG1 and CFG2 to GND
−0.3 V to +6.5 V
ENx to GND
−0.3 V to +21 V
VREG to GND
−0.3 V to +6.5 V
SYNC/MODE to GND
−0.3 V to +6.5 V
RT to GND
−0.3 V to +6.5 V
PWRGD to GND
−0.3 V to +6.5 V
FB1, FB2, and FB3 to GND
−0.3 V to +6.5 V
COMPx to GND
−0.3 V to +6.5 V
Storage Temperature Range
−65°C to +150°C
Operational Junction Temperature
Range
−40°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Thermal resistance values specified in Table 4 are simulated based
on JEDEC specs (unless specified otherwise) and are used in
compliance with JESD51-12. Using enhanced heat removal (PCB,
heat sink, airflow) technique improves thermal resistance values.
Table 4. Thermal Resistance
Package Type
θJA
θJC1
θJB
ΨJT
ΨJB
Unit
CC-43-1
26.0
14.3
9.3
0.2
9.0
(°C/W)
1
For θJC test, 100 µm thermal interface material (TIM) is used. TIM is assumed
to have 3.6 W/mK.
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com