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L99VR02XP Datasheet(PDF) 39 Page - STMicroelectronics |
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L99VR02XP Datasheet(HTML) 39 Page - STMicroelectronics |
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39 / 50 page ![]() 6 PowerSSO-36 PCB thermal data Figure 58. PowerSSO-36 on two-layers PCB (2s0p to JEDEC JESD 51-5) Note: Layout condition of Rth and Zth measurements (board finish thickness 1.6 mm ±10% board double layer, board dimension 129x60, board material FR4, Cu thickness 0.070 mm (front and back side), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm,Cu thickness on vias 0.025 mm). L99VR02XP PowerSSO-36 PCB thermal data DS14686 - Rev 1 page 39/50 |
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