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LAN91C100FD Datasheet(PDF) 77 Page - SMSC Corporation |
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LAN91C100FD Datasheet(HTML) 77 Page - SMSC Corporation |
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77 / 79 page ![]() FEAST Fast Ethernet Controller with Full Duplex Capability SMSC DS – LAN91C100FD Rev. D Page 77 Rev. 10/14/2002 PRELIMINARY Chapter 10 Package Outlines Figure 10.1 - 208 Pin QFP Package Outline Table 10.1 - 208 Pin QFP Package Parameters MIN NOMINAL MAX REMARK A ~ ~ 4.07 Overall Package Height A1 0.05 ~ 0.5 Standoff A2 3.17 ~ 3.67 Body Thickness D 30.35 ~ 30.85 X Span D1 27.90 ~ 28.10 X Body Size E 30.35 ~ 30.85 Y Span E1 27.90 ~ 28.10 Y body Size H 0.09 ~ 0.20 Lead Frame Thickness L 0.45 0.60 0.75 Lead Foot Length L1 ~ 1.30 ~ Lead Length e 0.50 Basic Lead Pitch θ 0 o ~ 7 o Lead Foot Angle W 0.10 ~ 0.30 Lead Width R1 0.08 ~ ~ Lead Shoulder Radius R2 0.08 ~ 0.25 Lead Foot Radius ccc ~ ~ 0.08 Coplanarity Notes: 1. Controlling Unit: millimeter. 2. Tolerance on the true position of the leads is ± 0.04 mm maximum. 3. Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm. 4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane. 5. Details of pin 1 identifier are optional but must be located within the zone indicated. |
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